The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 1990

Filed:

May. 12, 1988
Applicant:
Inventors:

Tadashige Konno, Tokyo, JP;

Makoto Saitoh, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F / ;
U.S. Cl.
CPC ...
361421 ; 361309 ; 361405 ; 361419 ; 336192 ;
Abstract

This invention discloses a composite type circuit part comprising a conductive plate formed at both wings with inductor place portions, respectively, a pair of first intermediate coupling elements in which an inductor place portion is formed at one end opposed to each inductor place portion of the wings, and a second intermediate coupling element with one end arranged opposedly of a central portion of the conductive plate and arranged at a position between the pair of first intermediate coupling elements. A lead wire coupling portions for holding a lead wire, is provided in the first intermediate coupling element and the second intermediate coupling element. Lead wires are coupled to the lead wire coupling portions, respectively. Inductors are placed on the opposed inductor plate portions, respectively. A chip condenser is placed over and between the central portion of the conductive plate and the second intermediate coupling element, thereby providing a positive coupling state of the lead wires. The central portion of the conductive plate is projected to enhance the mechanical strength. Further, upright elements are provided on the intermediate coupling element to enhance the mechanical strength. Moreover, holes for preventing a flow of solder are provided partially in the conductive plate.


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