The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 1990
Filed:
May. 16, 1989
Gerald R Dunn, Carlsbad, CA (US);
Dean R Haagenson, Vista, CA (US);
Michael J Pirozzoli, Pine Springs, MN (US);
Unisys Corporation, Blue Bell, PA (US);
Abstract
A machine for bonding leads from a chip to a substrate having top and bottom surfaces that are non-coplanar is comprised of a carrier for the substrate which includes a frame having a set of stops that terminate in a single plane and which are arranged in a pattern with a central opening. Also included in the carrier is a forcing mechanism which pushes on the bottom surface of the substrate such that the top surface of the substrate is pinned directly against all of the stops simultaneously and a portion of that top surface is exposed through the opening. This causes the exposed portion of the substrate's top surface to be aligned with the plane of the stops regardless of the degree of non-coplanarity that exists between the substrate's top and bottom surfaces. Further included in the machine are bonding blades which lie parallel to the single plane of the stops, and they move perpendicular to that plane through the opening to bond leads to the exposed top surface portion of the substrate as it is pinned to the stops.