The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 1990
Filed:
Jun. 16, 1988
Applicant:
Inventors:
Sheldon I Lieberman, Burlington, MA (US);
Eric A Barringer, Waltham, MA (US);
Brian C Foster, Sutton, MA (US);
Assignee:
Ceramics Process Systems Corp., Milford, MA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428137 ; 428209 ; 428210 ; 428426 ; 428432 ; 428433 ; 428901 ; 428689 ; 428697 ; 106-112 ; 106-121 ; 106-124 ; 106-127 ; 106-128 ; 75233 ; 75235 ; 75245 ; 75248 ; 252508 ; 252513 ; 252514 ; 252515 ; 252516 ;
Abstract
Bonding additives for refractory metallization compositions allow for circuit traces having good resistivities and adhesion values in excess of 6 kpsi, generally between about 10 and 20 kpsi. The inks are provided in formulations devoid of a glass component, and are suitable for co-sintering circuit traces and vias with 96% alumina substrates, and especially for 99% alumina substrates. Suitable bonding additives are the oxides of molybdenum, tungsten, niobium, manganese, yttrium, and titanium, or mixtures of such oxides.