The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 1990

Filed:

Apr. 27, 1987
Applicant:
Inventors:

Shingoro Fukuoka, Tokyo, JP;

Kouichi Shintomi, Yokohama, JP;

Ryu Maeda, Tokyo, JP;

Kaisuke Shiroyama, Nikko, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B / ;
U.S. Cl.
CPC ...
252512 ; 252518 ; 252514 ;
Abstract

A low-temperature burnt conductive paste prepared by dispersing, in an organic vehicle, a base material comprising 50 to 95% by weight of a powder of at least one conductive material selected from the group consisting of a copper alloy, a copper oxide and a copper alloy oxide and 5 to 50% by weight of a glass powder having a softening point of 300.degree. to 600.degree. C. and a coefficient of thermal expansion of 6 to 13.times.10.sup.-6 .degree.C..sup.-1, and a method of manufacturing a printed circuit board using this paste.


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