The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 1990
Filed:
Sep. 22, 1988
Applicant:
Inventors:
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361395 ; 174 523 ; 361387 ; 357 74 ;
Abstract
Electronic circuits (11,12) are mounted on a metal base (13). The metal base is covered by a mold resin case (16) at the peripheral portion thereof. A projected portion (29) is formed along all the peripheral edge portion of the metal base. A step portion is formed to the metal base next to the projected portion of the metal base. A groove (28) is formed along all the peripheral portion of the bottom surface of the mold resin case. The projected portion is engaged to the groove which is filled with a bonding material (33). The bottom surface of the step portion is also covered by the bonding material when the projected portion is thrust into the groove of the mold resin case.