The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 1990
Filed:
Apr. 25, 1989
Olympus Optical Co., Ltd., Tokyo, JP;
Abstract
A composite magnetic head comprising a read/write head section (6A) wherein a plurality of thin film heads are joined such that respective head gaps (R/W-1, R/W-2, . . . ) are aligned at predetermined intervals in the widthwise direction of tracks (T1, T2, . . . ), and an erase head section (6) wherein a plurality of bulk heads respectively corresponding to the thin film heads are joined such that respective head gaps (E1, E2, . . . ) are aligned at predetermined intervals in the widthwise direction of the tracks (T1, T2, . . . ), wherein the read/write head section (6A) and the erase head section (6B) are joined in the longitudinal direction of the tracks (T1 T.sub.2, . . . ) such that the head gaps (R/W-1) and (E1) and (R/W-2) and (E2) of the respective sections are relatively close to each other. The thin film heads can be replaced with a plurality of bulk heads (60A). A means (SW1-SW4, 77) can be added for two magnetic heads so that a predetermined voltage-divided signal of a read signal of one magnetic head differentially acts on a read signal of the other magnetic head. A step-up transformer (31, 32) can be mounted on a base (7) so as to step up the level of the signal picked up by a head chip (6) mounted on the base (7). A read/write switch circuit (100), a write amplifier (93), and a differential input amplifier (90) can be formed into a hybrid IC and mounted on the base (7).