The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 1990
Filed:
Mar. 28, 1988
Helmut Rusch, Regensburg, DE;
Guenter Waitl, Regensburg, DE;
Hansjoerg Harrasser, Regensburg, DE;
Hans-Juergen Richter, Planegg, DE;
Lee Francis, Melaka, MY;
Alois Seidl, Regensburg, DE;
Hans Wissinger, Regensburg, DE;
Hans-Joachim Hampel, Regensburg, DE;
Siemens Aktiengesellschaft, Berlin and Munich, DE;
Abstract
A lead frame adapted for a plurality of semiconductor chips in which, for each semiconductor chip, at least one electric terminal is extended out of the package after encapsulation of the lead frame. In addition, a process for the production of a lead with this lead frame, enables a full automation of the lead assembly and good, reliable production. The lead frame has at least one mechanical node (T1, T2, T3, T4; T) at which, by severing a single reinforced node, at least three electric conductors (1, 2, G; 3, 4, G; 5, 6, G; 7, 8, G; 21, 22, 23) are electrically separated from one another.