The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 1990
Filed:
Aug. 04, 1988
Applicant:
Inventor:
Takuma Yamada, Moriyama, JP;
Assignee:
Dainippon Screen Mfg. Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
4274301 ; 118429 ; 134 / ; 134 60 ;
Abstract
Time periods required for dipping semiconductor wafers in a treatment liquid in a treatment bath and for replacing the treatment liquid etc. are previously stored in a memory. Based on these data, the expected clock time when the semiconductor wafers reach each treatment bath is calculated and the replacement of the treatment liquid and transporation of the wafers are controlled on the basis of these data and the expected clock time.
Quick Actions:
Yamada, Takuma. (1990). Surface treatment method and apparatus therefor (U.S. Patent No. 4892761). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4892761
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