The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 1989

Filed:

Mar. 02, 1988
Applicant:
Inventor:

Vahak K Sahakian, Los Altos Hills, CA (US);

Assignee:

LSI Logic Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 74 ; 357 68 ;
Abstract

An improved package with J-leads for an integrated circuit is obtained by modifying the package profile so as to relieve the bottom edge to provide space for insertion of a rod to be used as a tool to shape or reshape the curved part of the leads. This permits both easier original manufacturing and faster and better reshaping of bent leads.


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Sahakian, Vahak. (1989). Semiconductor package profile (U.S. Patent No. 4890154). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4890154

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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