The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 1989
Filed:
May. 21, 1987
Hisashi Kojima, Tokyo, JP;
Tatsuo Miyagi, Tokyo, JP;
Technoplas Inc., Tokyo, JP;
Abstract
A method for the supervision of injection molding including monitoring an internal die pressure of molten resin flowing through a resin passageway in a mold to form a monitored waveform; displaying the monitored wavefrom together with a predetermined reference waveform on a display unit such as a CRT, and comparing the monitored waveform with an allowable value of the reference waveform to determine any abnormality caused in a molding process. The injection molding can be supervised with accuracy on the basis of the reference waveform representing the optimum internal die pressure, thereby increasing the quality of molded articles.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile