The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 1989
Filed:
Jun. 16, 1988
Kenshi Kondo, Tokyo, JP;
Nihon Den-Netsu Keiki Co., Ltd., Tokyo, JP;
Abstract
A soldering apparatus capable of forming a flowing layer of a molten solder with which an article to be soldered is contacted and the height of the upper surface of which is automatically controlled between predetermined upper and lower levels by continuously detecting the upper surface with two detectors. Each detector has a vertical pipe whose top is connected to a source of a pressurized gas and whose bottom is opened downward so that the pressure within the pipe is increased or released when the upper surface of the solder is positioned above or below the open bottom end of the pipe. A pressure switch is provided in each pipe to detect the increase and decrease of the pressure within the pipe to detect the upper surface of the solder layer.