Intelligent multiprobe tip

Abstract

A multiprobe tip assembly, and method of making same, for quality control testing of an integrated circuit wafer characterized by the precision control of the assembly in the z-axis. The assembly includes a probe tip mounting support member having at least one electrically conductive path disposed thereon, an electrically conductive probe tip member affixed thereto, and means for electrically coupling the probe tip member to the electrically conductive path. The improvement in combination with this assembly comprises the probe tip mounting support member being substantially composed of a high resistance piezoelectric material electrically responsive to mechanical pressure, means for subjecting the mounting support member to mechanical pressure caused of by probe tip member contact with the intergrated circuit wafer so that a piezoelectric voltage is produced therein, and at least one means for electrically coupling a voltage detection means to the support member for detecting the mechanically induced piezoelectric voltage so that z-axis control is precisely maintained relative to piezoelectric voltage amplitude.