The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 1989
Filed:
Jul. 14, 1987
Luigi Romano', Monza, IT;
SGS Microelectronica S.p.A., Catania, IT;
Abstract
A package for semiconductor devices provided with an encased metallic heat sink, wherein an encapsulating body of resin extends beyond the perimenter of the heat sink to form two side extensions, diametrically opposite with respect to a central portion of the body and elastically de-coupled from such a central portion of the resin body containing the heat sink and the semiconductor chip, by means of at least a thinned out zone of the resin body determined by one or more pairs of opposite grooves. Fastening points contemplated in said lateral extensions, are efficiently elastically de-coupled from the central portion of the body and the package is essentially free to blend along said pairs of opposite grooves without inducing stresses on the encased metallic heat sink onto which rests the semiconductor chip.