The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 1989
Filed:
Apr. 14, 1988
Applicant:
Inventors:
Kaoru Tominaga, Ichihara, JP;
Kojiro Kan, Ichihara, JP;
Toshimasa Takata, Ichihara, JP;
Toru Tomoshige, Ichihara, JP;
Assignee:
Mitsui Petrochemical Industries, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ;
U.S. Cl.
CPC ...
524430 ; 524506 ; 524514 ; 524588 ; 524425 ; 524431 ; 524451 ; 524404 ; 524437 ; 524401 ; 524424 ; 524730 ; 524731 ; 525422 ; 525431 ;
Abstract
A semiconductor encapsulating material is obtained from a polyimide resin composition comprising (A) a polyaminobismaleimide resin, (B) a silicone monomer and/or oligomer having a hydroxyl or alkoxyl group bonded to a silicon atom and mixtures thereof, and (C) an inorganic filler wherein the weight ratio of polyaminobismaleimide resin (A) to silicone component (B) ranges from 99.5/0.5 to 70/30, and the weight ratio of polyaminobismaleimide resin (A) to inorganic filler (C) ranges from 100/50 to 100/1000.