The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 1989
Filed:
Nov. 08, 1988
Shinji Mine, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A cooling system for a three-dimensional IC package in which a plurality of substrates each mounting ICs on its one or both surfaces are laminated with a predetermined interval therebetween, includes a cold plate in which holes are formed at positions corresponding to the ICs and a cooling fluid path are formed around the holes, a heat conductive piston, inserted in each hole of the cold plate while keeping a small gap with respect to the inner wall of the hole, and biased by a spring to be moved in the hole, for conducting, when one end thereof is brought into contact with a heat radiating surface of the IC, the heat to the cold plate, and a device for interrupting a contact between the heat conductive piston and the IC so that the substrate can be easily inserted/removed.