The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 1989
Filed:
May. 31, 1988
Takeshi Tanabe, Nagaokakyo, JP;
Toshio Hori, Nagaokakyo, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
In the chip type component installation structure wherein chips are arranged to be joined by solder to a fitting pattern provided on a printed substrate, resist films are set separately in the space of the fitting pattern in order to reduce the quantity of solder. The resist films are set in the space of the fitting pattern separately, so that the structure provides a lesser quantity of solder to join and fix chips, a continuous solder band over the fitting pattern, and a lesser but sufficient quantity of the solder. The structure prevents cracks and breakages of chips due to the expansion and contraction of solder, increases the polarity of solder against chips and electrodes, shortens the soldering time, and increases the reliability of chip installation work.