The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 1989
Filed:
Jul. 22, 1988
Arthur H Dornbusch, Cincinnati, OH (US);
Roger E Schanzle, Cincinnati, OH (US);
Irvin L Brazier, West Milwaukee, WI (US);
The Procter & Gamble Company, Cincinnati, OH (US);
Abstract
A flexible multilayer label adapted for application to deformable thermoplastic packages, with such label being impervious to water and sufficiently resilient to avoid permanent deformation upon deflection. The label includes a thermoplastic stress-compensating stratum having a relatively elastic structure which has a Young's Modulus less than about 2800 Kg/cm.sup.2 and a lower surface adapted to be bonded to the outer surface of the thermoplastic package during in-mold labeling procedures. The label further includes a thermoplastic label stratum having a Young's Modulus which exceeds about 7030 Kg/cm.sup.2 and a smooth label surface. The label stratum is laminated to the upper surface of the stress-compensating stratum. The stress-compensating stratum structure accommodates the thermal stresses and package shrinkage inherent in such in-mold labeling procedures, as well as stresses imposed by deformation of the package in use. As a result of such accommodating capabilities, the label surface of the label stratum is effectively isolated from such stresses and shrinkage and remains substantially smooth, and the laminated bonds between the label stratum, the stress-compensating stratum, and the deformable package remain substantially intact.