The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 1989
Filed:
Sep. 01, 1988
Jeffrey J Anderson, Portland, OR (US);
John S Moore, Beaverton, OR (US);
Ted E Deur, Portland, OR (US);
Joy Roy, Beaverton, OR (US);
Other;
Abstract
A first surface of a first metal component of an ink jet print head is bonded to a second surface of a second metal component of the ink jet print head, the first and second surfaces being of materials having the same or similar coefficients of thermal expansion. A layer of filler material is electroplated or otherwise placed on at least one of these surfaces. The filler material has a melting point which is below the melting point of the first and second components, and the total thickness of the filler material on the surfaces together is in the range of from approximately one-sixteenth micron to approximately five microns, with one-eighth micron to two microns being a preferred range. These surfaces are placed together and subjected to heat and pressure to diffusion bond the surfaces without melting the filler material. The diffusion bonding is performed in one approach until no more than approximately one micron of filler material remains between the surfaces. Thereafter, the filler material is melted without melting the first and second components to thereby braze the first and second components together.