The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 1989
Filed:
Apr. 18, 1989
Yoshitsugu Okada, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
According to a method of manufacturing a multi-layered wiring substrate, a palladium thin film is formed on an entire surface of a substrate including a conductor wiring layer. A portion except for a predetermined via formation portion on the palladium thin film is masked by a first photoresist. A polyimide-based conductive resin is embedded in the via formation portion through the first photoresist. The first photoresist is removed. The conductor wiring layer and the via formation portion are masked by a second photoresist. The exposed palladium thin film is etched. The second photoresist is removed. The conductive resin is cured. A photosensitive polyimide resin is applied to an entire surface of the substrate, a via-hole is formed in the via formation portion, and the photosensitive polyimide resin is cured.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile