The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 1989
Filed:
Dec. 18, 1987
Makoto Doi, Amagasaki, JP;
Hiroyukio Nakajima, Amagasaki, JP;
Fumiyuki Miyamoto, Amagasaki, JP;
Seiji Oka, Amagasaki, JP;
Mitsuhiro Nonogaki, Amagasaki, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A resin having a low dielectric constant obtained by heat-curing 100 parts by weight of a butadiene polymer containing in its polymer chain at least 50 mol% of a 1,2-butadiene unit having a double bond in its side chain and from 10 to 100 parts by weight of a vinyl compound having at least 3 vinyl groups in one molecule in the presence of an organic peroxide. Also disclosed is a resin having flame resistance obtained by heat-curing a blend of an organic peroxide with a composition comprising 100 parts by weight of a butadiene polymer containing in its polymer chain at least 50 mol% of a 1,2-butadiene unit having a double bond in its side chain, from 10 to 100 parts by weight of a vinyl compound having at least 3 vinyl groups in one molecule and at least one member selected from the compounds of the formulas I-IV: ##STR1## wherein X is H or CH.sub.3, Y is Br or Cl, A is --, --o--, --CO--, SO.sub.2, --CH.dbd.CH--, --C(CH.sub.3).sub.2 --or --(CH.sub.2 .sub.a --, ad each of m, n and a is an integer of from 1 to 4, in an amount of from 25 to 100 parts by weight in the case of the formulas I to III and from 25 to 200 parts by weight in the case of the formula IV.