The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 1989
Filed:
Sep. 11, 1987
Yukio Maeda, Hirakata, JP;
Matsushita Electric Industrial Co., Ltd., Kadoma, JP;
Abstract
An adhesive containing at least two main components, and which is capable of being gelled to make it pressure-sensitive, of being photopolymerized and of being thermally polymerized, is applied at selected positions on a printed circuit substrate on which electronic parts are to be loaded. Ultraviolet rays are irradiated on the adhesive, to gelate the adhesive thereby to realize the pressure-sensitive adhesion ability by reaction of a photopolymerization functional group of the adhesive. After loading the electronic parts on the adhesive, the adhesive is hardened by reaction of a thermal polymerization functional group by heating. Thereafter, electrodes of the electronic parts and conductive lands of the printed circuit substrate are soldered.