Semiconductor circuit packages for use in high power applications and

Abstract

A transfer molded semiconductor circuit package with two spaced, parallel, exteriorly accessible substrate plates located symmetrically to a medial plane of the package and encapsulated, to levels flush with their remote faces, in a body of low stress semiconductor grade molding compound. The package has precisely parallel outer faces constituted at least in part by the remote faces of the substrate plates and enabling full-surface engagement of the substrate plates with respective heat sinks. A method of making the package is also disclosed. The symmetry of the arrangement of the substrate plates inhibits any bending thereof during the molding of the package such as would occur in a single substrate plate due to differences between the thermal expansion coefficients of the molding compound and the substrate plates.