The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 1989

Filed:

Mar. 24, 1989
Applicant:
Inventors:

Tamio Saito, Tokyo, JP;

Kunio Yosihara, Kawasaki, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 68 ; 357 80 ; 357 71 ;
Abstract

A semiconductor integrated circuit device according to the present invention comprises a chip substrate formed of a semiconductor. Formed on a surface of the chip substrate is an integrated circuit and a plurality of chip terminals which are located to the outside of the integrated circuit, so as to be connected thereto. An electrical insulating layer covers the entire surface of the chip substrate, and conductor leads equal in number to the chip terminals are formed on the insulating layer. One end of each conductor lead is connected to a corresponding chip terminal, and the other end thereof is formed having a connecting terminal whose surface area is greater than that of each chip terminal. The connecting terminals are distributed substantially over the entire surface of the insulating layer.


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