The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 1989
Filed:
Mar. 21, 1988
Applicant:
Inventors:
Gerard H Michaud, Furlong, PA (US);
James H Graham, Pottstown, PA (US);
Roger P Stout, Chandler, AZ (US);
Assignee:
Kulicke & Soffa Industries, Inc., Willow Grove, PA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
29840 ; 29709 ; 29740 ; 29743 ; 29759 ;
Abstract
This invention relates to apparatus for and methods of bonding a component to a substrate. More particularly, this invention relates to apparatus for and methods of removing small components, such a dies or other electrical components, from a wafer and bonding the components to a substrate.
Michaud, Gerard. (1989). Apparatus for and methods of die bonding (U.S. Patent No. 4876791). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4876791
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile