The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 1989
Filed:
Oct. 27, 1987
Applicant:
Inventors:
Hiroshi Hasegawa, Kanagawa, JP;
Koichi Sugimoto, Hiratsuka, JP;
Takeshi Yano, Yokohama, JP;
Tositada Netsu, Hatano, JP;
Mitsukiyo Tani, Odawara, JP;
Tosaku Kojima, Yokohama, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
228179 ; 228-45 ; 219 561 ; 219 5622 ; 361405 ;
Abstract
The invention relates to joining of fine wires, and more particularly to a wire bonding method suitable for connecting a number of wires within a narrow area. A first wire is bonded on a pad, and a second wire is bonded on the position where the first wire has been bonded. Bonding of a subsequent wire is performed in that the wire is stacked and bonded in similar manner mentioned above. Thus a plurality of repair wires can be bonded within one pad even if the pad area is very small.