The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 1989

Filed:

Aug. 04, 1988
Applicant:
Inventors:

Murli Hinduja, Fremont, OH (US);

Mark L Thompson, Fremont, OH (US);

John R Spriggs, Fremont, OH (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N / ;
U.S. Cl.
CPC ...
73 56 ; 73866 ; 374 51 ;
Abstract

An apparatus and method for testing the flow characteristics of molding compounds includes upper and lower mold portions movable relative to one another. The lower mold portion has formed therein a central cavity and a channel extending therefrom with scribe marks formed on a bottom wall of the channel. The upper mold portion has a complimentary raised area for cooperation with the cavity and the channel to force molding compound placed in the cavity to flow down the channel providing an indication of the flow characteristics of the molding compound. Ejector pins positioned in the bottom of the cavity and the channel are actuated by an ejector pin plate which is coupled to the upper mold portion to eject the sample when the mold portions are separated.


Find Patent Forward Citations

Hinduja, Murli. (1989). Apparatus and method for testing flow characteristics of molding (U.S. Patent No. 4875363). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4875363

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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