The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 1989
Filed:
Dec. 17, 1987
Kiyoshi Sudani, Kashima, JP;
Yoshihiko Sunami, Kashima, JP;
Sumitomo Metal Industries, Ltd., Osaka, JP;
Abstract
A molding process of a molding compound containing an ingredient such as a binder, e.g., pitch or a thermosetting resin which generate gas before being set, is disclosed, wherein the molding compound is heated and molded under pressure according to a special temperature pattern. First, the molding compound may be preheated substantially uniformly to a temperature at which the binder melts and generates reaction gas. Next, temperature gradient in the direction of thickness of the molding is created while raising the temperature of the molding to an upper limit temperature so that the setting of the molding progressively advances from the higher temperature to the lower temperature side of the molding.