Apparatus for cutting and stripping insulation from wire segments having

Abstract

An apparatus for cutting a portion of insulation adjacent the ends of wire segments having different gauge conductors for the purpose of stripping the cut portion therefrom. This apparatus includes a main frame; a workstation on the frame that presents a processing point at which the wire segment will be momentarily positioned during operation for cutting of the insulation as it follows a path of travel; a plurality of sets of cutting knives with each set having a cutting edge profile sized to cut the insulation on a specific gauge of conductor; and a mechanism for reciprocally mounting each of the sets of cutting knives on a position of the main frame to extend radially away from opposite sides of the processing point to circumferentially space all of said radially extending sets around the processing point and for causing reciprocal movement of the knives in each set toward the processing point to a closed cutting position and away from the processing point to enable selective energization of a set of knives properly sized to fit the gauge of the wire segment conductor then at the processing point. The apparatus may also include a mechanism for stripping the cut insulation portion from the conductor which includes a subframe pivotally mounted on the main frame with the sets of cutting knives being mounted on the subframe. The subframe is moved by an actuator in a direction generally parallel to the path of wire segment travel to strip the cut portion of insulation.