The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 1989
Filed:
Jul. 08, 1988
Robert K Grebe, Scottsdale, AZ (US);
John E Lucius, Glendale, AZ (US);
David S Szczesny, Glendale, AZ (US);
AMP Incorporated, Harrisburg, PA (US);
Abstract
An adapter substrate (40) for carrying one or more electrical components (80,90), includes plated circuitry to which the components are connectable, to comprise a member securable between a chip carrier socket (20) and a printed circuit panel (14) and provide electrical interconnection therebetween. The electrical components are connected to selected ones of the interconnections between the socket and the panel in order to modify, effect or sense the selected interconnections. While the other interconnections are passed through the substrate such as by plated through-holes (44), the selected interconnections are interrupted by the dielectric material of the substrate (40) and are plated blind holes (46) connected by path segments (120) to be electrically connected to the one or more electrical components; completing the connection to the socket's contacts are plated through-holes (116) and path segments (128) to contact pads (52). Into the plated through-holes and plated blind holes alike can be inserted post members (42) matable with plated through-holes (16) of the panel; contact sections connectable with the socket's contacts (28 ) can be pads (52) for surface mounting. One such adapter can be used to fabricate an assured backup power supply (10) for an IC chip carried in the socket (20), when a battery (80) and a logic chip control circuit (90) therefor are the electrical components.