The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 1989

Filed:

Dec. 10, 1987
Applicant:
Inventors:

Kazuo Kondo, Aichi, JP;

Asao Morikawa, Aichi, JP;

Hiroshi Iwata, Aichi, JP;

Yoshimasa Shibata, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428209 ; 428210 ; 428432 ; 428433 ; 428689 ; 428702 ; 428901 ; 106-113 ; 106-114 ; 106-118 ; 106-119 ; 106-125 ; 252512 ; 252518 ; 252520 ;
Abstract

A high-density wiring multi-layered substrate comprising a plurality of sequentially laminated green sheets containing crystallizable glass, each of the green sheets having a conductor paste on the surface thereof, the conductive component of the conductor paste comprising at least about 80 wt % of one copper component selected from copper and copper oxide and at least one member selected from up to about 15 parts by weight of MnO.sub.2 and up to about 10 parts by weight of Ag.sub.2 O based on 100 parts by weight of said copper component in terms of metallic copper.


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