The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 1989

Filed:

Feb. 25, 1988
Applicant:
Inventors:

Minoru Ohta, Okazaki, JP;

Kazuhiko Miura, Aichi, JP;

Seizi Huzino, Anjo, JP;

Kenji Kanehara, Aichi, JP;

Tadashi Hattori, Okazaki, JP;

Assignee:

Nippon Soken, Inc., Nishio, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F / ;
U.S. Cl.
CPC ...
7320426 ; 731182 ;
Abstract

In a direct-heated flow measuring apparatus including a substrate having a film resistance pattern and a supporting member for supporting the substrate, the supporting member has good heat dissipation characteristics. Provided between the substrate and the supporting member is a heat transfer throttling portion.


Find Patent Forward Citations

Ohta, Minoru. (1989). Direct-heated flow measuring apparatus having improved response (U.S. Patent No. 4870860). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4870860

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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