The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 1989
Filed:
May. 21, 1987
Applicant:
Inventors:
Keiichirou Nakanishi, Kokubunji, JP;
Minoru Yamada, Iruma, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 82 ; 361385 ;
Abstract
An improved integrated circuit chips cooling module in which a cooling member having an inside space through which a coolant flows is attached to each of the integrated circuit chips by pressure welding or anchoring to effect cooling, wherein the improvement comprises providing coated portions for each portion of the surface of the coolant flow system where the coolant leakage may possibly take place, the coating of said coated portions comprising an organic or inorganic high-molecular weight compound curable by reacting with the coolant to keep the latter from leakage.