The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 1989
Filed:
Jul. 12, 1988
Thomas C Clarke, Morgan Hill, CA (US);
Caroline A Kovac, Ridgefield, CT (US);
Dae Y Jung, Endwell, NY (US);
Jae M Park, Mahopac, NY (US);
Richard R Thomas, Fishkill, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A process for preparing a substrate, e.g., an epoxy printed circuit board, for subsequent metallization. Active chemical sites are formed adhering to the substrate surface. The substrate is then exposed to a vapor of a volatile organometallic compound, which chemically reacts with the active sites and is decomposed to at least a species of the metal constituent of the compound. This species adheres to the substrate and can be transformed into the free metal which is useful as a seed for subsequent electroless deposition of a metal thereon. If selective deposition is desired, a resist masking layer is used prior to forming the seed layer. Volatile organopalladium compounds, such as (cyclopentadienyl)(allyl)palladium and bis(allyl)pallidium, are particularly effective for depositing a palladium seed which is particularly effective for electroless deposition of copper.