The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 1989
Filed:
May. 02, 1988
Norman J Roth, Kokomo, IN (US);
Ronnie J Runyon, Russiaville, IN (US);
Delco Electronics Corporation, Kokomo, IN (US);
Abstract
Redundant interconnection bonds are formed on an integrated circuit using an interconnection lead comprising a plurality of electrically conductive fingers separated from each other by an electrically nonconductive medium. The individual conductive fingers are attached to, and extend out from, an electrically conductive base at one end. In addition, the individual conductive fingers are connected to each other at a separate region. The improved interconnect lead is structurally durable and the resulting redundant bond exhibits improved electrical and operating characteristics. The interconnection lead is suitable for use with tape automated bonding or flexible circuitry technologies.