The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 1989

Filed:

Jan. 29, 1987
Applicant:
Inventors:

Seigo Nambu, Tokyo, JP;

Hiroyuki Fukazawa, Tokyo, JP;

Shinji Takei, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 72 ; 357 68 ; 357 70 ;
Abstract

A plastic-sealed IC device comprises an IC lead frame having a chip mounting area, an IC chip fixedly mounted on the IC lead frame in the chip mounting frame area, and a plastic package molded so as to seal the IC lead frame therein. The plastic package has an opening formed so as to allow the backside of the chip mounting area to communicate with the atomonphere to discharge the moisture accumulating in the vicinity of the IC chip.


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