Charge transfer signal processor and charge transfer feedthrough plate

Abstract

The disclosed charge transfer signal processor includes a vacuum housing having an input face and an output face, a 2-D electromagnetic input means cooperative with said input face for providing a 2-D input electronic charge signal within the vacuum housing, transfer means for imaging the 2-D input electronic charge signal in a region of the vacuum housing proximate the vacuum housing output face, and charge feedthrough means coupled to the vacuum housing output face for transferring the imaged 2-D electronic charge signal externally to the vacuum housing. In one embodiment, the charge transfer signal processor is operable as Gen-1 charge transfer amplifier. In another embodiment, a microchannel plate assembly is disposed in the vacuum housing intermediate the input and output faces, and the charge transfer signal processor is operable as a high-gain charge transfer signal amplifier. In a futher embodiment, a power microchannel plate assembly is disclosed that is disposed in the vacuum housing intermediate the input and output faces, and the charge transfer signal processor is operable as a high-current charge transfer signal amplifier. The disclosed power microchannel plate assembly preferably includes a 2-D array of axially-aligned discrete dynodes, and a voltage divider network operatively coupled to the 2-D array for providing an electron accelerating potential gradient and for replacing charge as it is depleted by secondary electron emission processes in the several discrete dynodes. The 2-D input electromagnetic signal may either be optical, electronic, or a combination of these two. Various output devices externally mounted to the output face of the vacuum housing are disclosed. Utility includes spatial phase and/or amplitude light modulation, 2-D optical signal processing, and, among others, electromagntic signal detection. A method and an apparatus are disclosed for fabricating the charge feedthrough means.