The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 1989
Filed:
Jun. 29, 1988
Russell W Boehm, Longmont, CO (US);
Rex A Guinn, Stamping Ground, KY (US);
Hans J Koerner, Round Rock, TX (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A family of circuit boards are molded, each board having its own unique pattern of recessed circuit paths and component insertion through-holes. A different mold is provided for each different member of the family. The two cavity blocks of each mold cavity contain only the holes that are necessary to define the through-hole pattern for that member of the family. A plurality of core pins or wires are provided at the molding site. Only the core pins that are required by the mold in use at the molding site are rendered operative. Features of the method and apparatus, in addition to this core pin insertion feature, include (1) the molding site includes a base member that is usable with all molds of the family, and has means for injecting molding material and means for ejecting a finished circuit board, the injection means and the ejecting means being located in the board's scrap edge area, (2) a hot runner injection system, (3) the mold cavity is placed under a partial vacuum prior to injection, (4) a semiconductor device is selectively used to rapidly heat or cool the mold, and (5) robot means, air and vacuum aids in ejection of a circuit board.