The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 1989
Filed:
Feb. 16, 1988
Applicant:
Inventor:
Hirofumi Maeda, Takatsuki, JP;
Assignee:
Kanegafuchi Kagaku Kogyo Kabushiki Kaisha, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08J / ; C08J / ; C08J / ;
U.S. Cl.
CPC ...
264 50 ; 264 53 ; 264D / ; 264D / ; 264D / ; 521 60 ;
Abstract
The present invention provides a process for production of expansion-molded articles in a mold of a linear low density polyethylene resin which comprises compressing pre-expanded linear low density polyethylene resin beads having two melting points when measured by differential scanning calorimetry and, when the melting point at a low temperature side and the melting point at a high temperature side are designated T.sub.ML and T.sub.MH respectively, between said two melting points and the peak fusion area at said T.sub.ML is designated A.sub.L and the peak fusion area at said T.sub.MH is designated A.sub.H satisfying: