The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 1989

Filed:

Nov. 30, 1987
Applicant:
Inventors:

Takehisa Sugahara, Kawasaki, JP;

Toyokatu Nakagawa, Aizuwakamatsu, JP;

Junichi Yano, Yokohama, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437-8 ; 437206 ; 206330 ; 357 70 ; 357 80 ; 357 81 ;
Abstract

A semiconductor device comprising: a semiconductor chip; a package for accommodating the chip; groups of leads which are arranged around the perimeter of the package; and strip; insulators, such as plastic films, to each of which one of the groups of leads are adhered. In addition, a method for manufacturing the device, comprising the steps of: preparing a package including a semiconductor chip and having lead frames each of which is composed of leads and a supporting end portion; adhering the lead frames to an insulating sheet such as a plastic film; and clipping off the portions of the insulating sheet to which the supporting end portions are adhered.


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