The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 1989
Filed:
Apr. 25, 1985
Hisakazu Yasumuro, Yokohama, JP;
Michio Watanabe, Yokohama, JP;
Kazuo Taira, Tokyo, JP;
Tsuneo Imatani, Yokosuka, JP;
Hideo Kurashima, Yokosuka, JP;
Toyo Seikan Kaisha, Ltd., Tokyo, JP;
Abstract
Disclosed is a metal vessel comprising upper and lower members, each of which consists of a seamless molded metal cup having a protecting resin cover layer, the open end portions of the upper and lower members being lap-bonded to each other through an adhesive to form a circumferential side seam, said metal vessel being characterized in that the open end portion defining the inner side of the circumferential side seam has a layer of a thermoplastic resin adhesive tape heat-bonded along the entire circumference of said end portion while wrapping the end edge and adjoining inner and outer side faces therein, a layer located on the outer side face of the adhesive tape is extended along the lap-bonded portion, and the adhesive layer present in the lap-bonded portion satisfies the following requirement: ##EQU1## wherein S1 stands for the sectional area (mm.sup.2) of the adhesive layer present in the lap-bonded portion, lo stands for the width (mm) of the lap-bonded portion, and t.sub.o stands for the thickness (mm) of the adhesive tape present on the inner side of the inner open end portion.