The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 1989
Filed:
Aug. 08, 1988
Paul R Hughes, Sudbury, MA (US);
GTE Spacenet Corporation, Waltham, MA (US);
Abstract
A compact electronic housing for a satellite earth station is described. The compact electronic housing comprises a first compartment and a second compartment separated by a panel common to both compartments. The first compartment contains electronic components and is atmospherically isolated from outside air and the second compartment. The electronic components comprise a plurality of groupings. The second compartment provides for movement of outside air into the second compartment through a bottom opening and out a top opening by a chimney effect cooling a plurality of heat exchangers. The panel dividing the two compartments comprises a plurality of conductive heat transferring elements for transferring heat from the electronic components to the plurality of heat exchanger element. The plurality of conductive heat transferring elements are thermally insulated from each other by an insulating material; thereby, maintaining a temperature differential between the groups of electronic components even though there is a close physical proximity between the groups. The electronic components are connected to one side of the conductive heat transferring elements and the heat exchanger elements are connected to the other side of the conductive heat transferring elements. The electronic components having the greatest heat generating capacity and/or highest allowable operating temperature are physically separated and/or located above the other electronic components.