The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 1989
Filed:
Jun. 29, 1988
Masayuki Saito, Yokohama, JP;
Akira Niitsuma, Yokohama, JP;
Hirosi Ohdaira, Chigasaki, JP;
Chiaki Tanuma, Tokyo, JP;
Miki Mori, Kawasaki, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A support is formed and comprises a base, a resin layer which is formed on the base and on recesses which are formed on a surface of the base, and a conductive layer which is formed on a portion of a surface of the resin layer, other than where the recesses are formed. The surface of the recesses is electrically charged by way of a corona discharge to create static electricity in the recesses. Metal balls to be formed into bump electrodes are held in the recesses by way of the static electricity. Then, each of the metal balls is bonded to a corresponding electrode terminal of an electronic component by hot press unit while the electronic component is opposed to the support.