The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 1989
Filed:
Aug. 08, 1988
Applicant:
Inventors:
John M Graff, West Suffield, CT (US);
Harry A Nutter, Jr, Longmeadow, MA (US);
Leon Stoltze, East Hartland, CT (US);
Assignee:
United Technologies Corporation, Hartford, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21K / ; B21D / ;
U.S. Cl.
CPC ...
2915 / ; 29423 ; 264 401 ; 72363 ; 156323 ;
Abstract
Bonding pressure is uniformly applied to the lay-up (70) of a bonded product (10) by the disposition of flexible, compressible, perforated sheet material (85) between the lay-up and a pair of molds (75 and 80) during the manufacture of the product by diffusion bonding.