The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 1989
Filed:
Jun. 03, 1988
Vikram Bhargava, Alpharetta, GA (US);
James R Heberling, Lawrenceville, GA (US);
Hayes Microcomputer Products, Inc., Norcross, GA (US);
Abstract
An improved standoff for use in assembly of an electronics device includes a generally cylindrical body with a bore hole through the longitudinal axis. A plurality of reinforcing fin-shaped members disposed radially about the outer surface provide additional rigidity to the structure as well as providing surfaces at each end of the standoff upon which circuit boards may rest. A plurality of clips may be moved under compression and passed through holes on a circuit board. Once they have passed through, they will elastically return to their normal position thus loosely, but securely, holding the circuit boards together. This allows the standoffs to hold the circuit boards together, without the use of additional nuts and bolts and conventional spacers, and also allows the passing of final assembly screws through the longitudinally bore of the spacer. An electrically conductive stamped metal spring clip is provided over a mounting post and serves the dual function of providing electrical contact between grounded conductors on a circuit board and the equipment enclosure, as well as providing a spring to compensate for mechanical tolerances and to assure the application of sufficient stress to an assembly screw to maintain the apparatus in a dependable assembly state irrespective of subsequent stress relaxation in any plastic components.