Thin film semiconductor interconnect module

Abstract

A thin film interconnect module utilizes a plurality of electroplated conductors disposed in one or more signal layers and surrounded by a dielectric having substantially the same thickness as the conductors to form a substantially planar layer. A metal/dielectric film is employed electrically to interconnect with various ones of the conductors during the electroplating process. After electroplating, selected ones of the electrical interconnections are broken by heating or irradiating selected ones of the interconnections. A dielectric-like film composed of microscopic non-contacting metal islands is used to link conductors that may subsequently need to be electrically connected, the electrical connection being achieved by melting the islands to form a continuous metal film. Interconnections between different planar layers may be achieved by the use of plated through holes. The process permits high density, high aspect ratio conductors to be fabricated on a multi-layer interconnect module.