The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 1989
Filed:
Jul. 13, 1988
Joseph Funari, Vestal, NY (US);
Mary C Green, Endicott, NY (US);
Scott D Reynolds, Endwell, NY (US);
Bahgat G Sammakia, Johnson City, NY (US);
International Business Machines Corp., Armonk, NY (US);
Abstract
An electronic package including a first substrate (e.g., printed circuit board), a semiconductor device (e.g., silicon chip), a second circuitized substrate (e.g. polyimide having chrome-copper chrome circuitry thereon) and a heat sink (e.g., extruded aluminum or copper). The heat sink includes pliant members (e.g., pliable leg members) secured thereto or forming part thereof such that the heat sink can be downwardly depressed a predetermined distance to effect contact with the semiconductor device without causing damage thereto. Such downward depression facilitates assembly of the package.