The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 1989

Filed:

Aug. 16, 1988
Applicant:
Inventors:

Thomas N Jackson, Peekskill, NY (US);

Masanori Murakami, Goldens Bridge, NY (US);

William H Price, East Rockaway, NY (US);

Sandip Tiwari, Ossining, NY (US);

Jerry M Woodall, Bedford Hills, NY (US);

Steven L Wright, Yorktown Heights, NY (US);

Assignee:

IBM Corporation, Armonk, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 71 ; 357 67 ;
Abstract

In a semiconductor device, a contact with low resistance to a III-V compound semiconductor substrate was fabricated using refractory materials and small amounts of indium as the contact material. The contact material was formed by depositing Mo, Ge and W with small amounts of In onto doped GaAs wafers. The contact resistance less than 1.0 ohm millimeter was obtained after annealing at 800.degree. C. and the resistance did not increase after subsequent prolonged annealing at 400.degree. C.


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