The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 1989
Filed:
Dec. 14, 1987
Applicant:
Inventors:
John F Scanlon, Roscoe, IL (US);
William D Sherman, Genoa, IL (US);
Assignee:
Sundstrand Corporation, Rockford, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427 34 ; 1562722 ; 1562733 ; 20419211 ; 20419212 ; 20419231 ; 20415744 ; 228122 ; 228208 ; 427 37 ; 427 38 ; 427223 ; 427225 ; 427299 ; 427423 ;
Abstract
A method is provided for improving the adhesion of a substrate material which does not form stable bonds to a bondable material by applying high energy bondable ions to the surface of the substrate to create an interface alloy layer and then adhering a bondable material to the surface of the substrate material. The high energy ions used may be meal ions. Before adhering, the thickness of the interface layer may be increased to form a layer utilizing conventional processes such as flame spray, plasma spray or D-gun spray. Additionally, the method may be used to join similar or dissimilar first and second substrate materials.