The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 1989
Filed:
Sep. 02, 1986
Applicant:
Inventors:
Toshio Toyama, Saitama, JP;
Kazuya Kato, Saitama, JP;
Tadamasa Tanaka, Saitama, JP;
Masashi Yajima, Saitama, JP;
Harutaka Hayasaka, Saitama, JP;
Toru Arai, Saitama, JP;
Hitoshi Terada, Saitama, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ; B23K / ;
U.S. Cl.
CPC ...
219 851 ; 219373 ; 219 8512 ; 2281802 ;
Abstract
A reflow soldering apparatus for soldering parts which are temporarily fixed on a substrate by using cream solder. The apparatus includes a hot gas blower provided with a number of holes for blowing hot gas through the holes. The apparatus also includes a substrate moving mechanism for moving the substrate along the hot gas blower at a distance therefrom to expose the substrate to hot gas blown through the holes, thereby reflowing the cream solder.