The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 1989

Filed:

Nov. 17, 1987
Applicant:
Inventor:

Hisashi Watanabe, Kitakyushu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G / ;
U.S. Cl.
CPC ...
528353 ; 528188 ; 528184 ; 5283291 ;
Abstract

Polyamide-imides of low thermal expansivity having a repeating structural unit of the general formula (I) ##STR1## in which Ar is a tetravalent aromatic group, A is --NHCO--, R1 through R3 are alkyl, alkoxy, or halogen, l, m, and n are integers from 0 to 4, x is 0 or 1, and y is an integer indicating the number of repeating units and in which at least one alkoxy group is present, show improved mechanical (for example, flexibility) and adhesive properties and low water absorption and are useful for the manufacture of flexible base materials for printed circuit boards, etc.


Find Patent Forward Citations

Watanabe, Hisashi. (1989). Resins of low thermal expansivity (U.S. Patent No. 4847353). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4847353

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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